摘要 |
<p>The disclosure relates to a magnet arrangement (800, 900, 1000) for a sputtering system, wherein the magnet arrangement is adapted for a rotatable target (126a, 126b) of a sputtering system and includes: a first magnet element (810, 910, 1010) extending along a first axis (X); a second magnet element (820, 920, 1020) being disposed around the first magnet element symmetrically to a first plane (A); wherein the second magnet element includes at least one magnet section (826, 827, 926, 927, 1028) intersecting the first plane; and wherein a magnetic axis (822, 922, 1022) of the at least one magnet section is inclined with respect to a second plane (B) being orthogonal to the first axis(X). Further, the disclosure relates to a target backing tube for a rotatable target of a sputtering system, a cylindrical rotatable target for a sputtering system, and a sputtering system.</p> |
申请人 |
APPLIED MATERIALS, INC.;LOPP, ANDREAS;GRILLMAYER, JUERGEN;KROCK, WOLFGANG |
发明人 |
LOPP, ANDREAS;GRILLMAYER, JUERGEN;KROCK, WOLFGANG |