| 摘要 |
Disclosed is a photosensitive resin composition capable of displaying satisfactory patterning performance against an alkaline developer and yielding a cured film of a sufficiently low coefficient of linear thermal expansion. The photosensitive resin composition contains a photopolymerization initiator and a polyimide precursor obtained by the reaction of an ester-containing diamine such as 4-aminophenyl 4′-aminobenzoate, a biphenyl-based diamine such as 4,4′-diamino-2,2′-dimethylbiphenyl, and an unsaturated group-containing diamine such as 4,4′-diamino-2,2′-divinylbiphenyl with an acid anhydride such as pyromellitic dianhydride. The content of the structural unit derived from the unsaturated group-containing diamine in the polyimide precursor is 5-60 mol %.
|
