| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a multilayer printed wiring board in which connection can be made appropriately with an incorporated IC chip. SOLUTION: With reference to the positioning mark 23 of an IC chip 20, a positioning mark 31 is formed on a core substrate 30 and a via hole 60 is made while matching with the positioning mark 31. The via hole 60 can be made accurately above a pad 24 of the IC chip 20 and the pad 24 can be connected surely with the via hole 60. |
