LASER CUTTING APPARATUS AND METHOD CAPABLE OF CUTTING WORKPIECE HAVING MULTI LAYER

摘要

PURPOSE: A device and method for cutting multiple-layered processing product using laser are provided to rapidly cut a processing object of multi-layered by emitting laser beam having different wavelengths according to the kind of a processing object. CONSTITUTION: A device for cutting multiple-layered processing product using laser comprises first and second laser units(100) and a condensing lens unit(400). The first and second laser unit outputs beam having different wavelengths. The condensing lens unit focuses the light from the first and second laser unit on a target. The condensing lens unit condenses the first laser beam in a top material layer. The second laser beam is condensed in a bottom material layer(602) after the cut of the top material layer is completed.