| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce occurrence of electromagnetic failure, in a thermal head including a printed wiring board. <P>SOLUTION: This thermal head X includes: a substrate 7; a plurality of heat generating parts 9 arranged on the substrate 7; a head base body 3 which is provided on the substrate 7 and has drive ICs 11 each controlling a current carrying state of each heat generating part 9; the printed wiring board 5 extending along an arrangement direction of the heat generating parts 9; and a cover member 6 which has electrical conductivity and is provided on the printed wiring board 5 such that the cover member 6 covers the printed wiring board 5. The printed wiring board 5 has a plurality of printed wires 5b for supplying electric signals for operating the drive ICs 11 or currents for heat-generating the heat generating parts 9, and each of facing areas 6as of the cover member 6 facing to wiring areas 5bs of the printed wires 5b extending along the arrangement direction of the heat generating parts 9 is disposed with a plurality of through holes 6g such that the through holes 6g continue over the whole width of the facing area 6as in a direction perpendicular to the arrangement direction when seeing through the facing area 6as from the arrangement direction of the heat generating parts 9. <P>COPYRIGHT: (C)2012,JPO&INPIT |
