VACUUM PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus having high productivity per installation area.

SOLUTION: A vacuum processing apparatus comprises: first and second lock chambers connected in parallel to the back side of an atmosphere conveyance chamber; a first conveyance chamber connected to the first lock chamber in the rear of the first lock chamber; a second conveyance chamber connected to the first conveyance chamber in the rear of the first conveyance chamber; a third conveyance chamber connected to the second lock chamber in the rear of the second lock chamber; first and second relay chambers respectively arranged between the first conveyance chamber and the second conveyance chamber and between the first conveyance chamber and the third conveyance chamber, and through which wafers are conveyed between these chambers; and a plurality of processing chambers connected to the first, second or third conveyance chamber. The number of processing chambers connected to the second conveyance chamber is greater than the number of processing chambers connected to the first or third conveyance chamber. Only the wafers processed in the processing chambers connected to the first or second conveyance chamber are conveyed in the second relay chamber to the third conveyance chamber.

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