发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition showing good resolution, and good electric insulation characteristics and strength in a cured product thereof. <P>SOLUTION: A positive photosensitive resin composition contains (A) an alkali soluble resin having a phenolic hydroxy group, (B) a compound having a quinonediazide group, (C) a compound having at least two alkyl-etherified amino groups in the molecule, (D) an acrylic resin comprising a constitutional unit (d1) represented by the following general formula (1) and a constitutional unit (d2) derived from an unsaturated carboxylic acid and having a mass-average molecular weight of 20,000 to 500,000, and (S) a solvent. In the general formula (1), R<SP POS="POST">1</SP>represents a hydrogen atom or an alkyl group, R<SP POS="POST">2</SP>independently represents a hydrocarbon group, and p represent 0 to 3. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012008425(A) 申请公布日期 2012.01.12
申请号 JP20100145819 申请日期 2010.06.28
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ISHIKAWA KAORU;ANDO TOMOYUKI;SENZAKI TAKAHIRO
分类号 G03F7/023;C08F20/18;G03F7/004 主分类号 G03F7/023
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