LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A lead frame and a manufacturing method thereof are provided to increase surface roughness of a rough copper layer by properly controlling copper ion density, current density, time, and additive input. CONSTITUTION: A rough copper layer(20) is comprised of a single plating layer. The average thickness of a rough copper layer is 0.3 to 0.6 um. The plating layer is directly contacted with a copper substrate(10). A nickel layer(40) includes nickel on a copper plating layer. A palladium layer(50) is formed on the nickel layer.