发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus in which a plurality of processing chambers to perform processing on substrates are connected to a vacuum conveyance chamber and which can suppress increase in an installation area (footprint) by suppressing the increase of apparatus size due to attachment/detachment of the lid of the processing chambers. <P>SOLUTION: A substrate processing apparatus uses a same lid retention mechanism 741 for attaching/detaching (opening/closing) lids 52 by holding them. The substrate processing apparatus includes the lid retention mechanism 741 arranged on a revolving arm 7 extended from a rotary table 721 above a vacuum conveyance chamber 4, and the lid retention mechanism 741 can rotate above upper regions of processing chambers 5 along the circumferential direction of the vacuum conveyance chamber 4 in a state where the lid retention mechanism 741 holds a lid 52 of a processing chamber 5 or a load lock chamber 3. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012004502(A) 申请公布日期 2012.01.05
申请号 JP20100140909 申请日期 2010.06.21
申请人 TOKYO ELECTRON LTD 发明人 TANAKA YOSHITSUGU;HATORI KAZUNARI;KASAHARA TOSHIHIRO
分类号 H01L21/677 主分类号 H01L21/677
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