| 发明名称 |
Injection Molding Apparatus |
| 摘要 |
The injection molding apparatus includes a first mold, a second mold, and a film having a micro pattern. The film contacts an injection molding material injected into a space defined by the first mold and the second mold.
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| 申请公布号 |
US2012001364(A1) |
申请公布日期 |
2012.01.05 |
| 申请号 |
US201113162944 |
申请日期 |
2011.06.17 |
| 申请人 |
SHIN YONG SEUNG;LIM KI YUL;LEE GEUN HO;LEE YOUNG SOO;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
SHIN YONG SEUNG;LIM KI YUL;LEE GEUN HO;LEE YOUNG SOO |
| 分类号 |
B29C45/14 |
主分类号 |
B29C45/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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