| 摘要 |
The present invention provides a process for producing a stamp for hot embossing (HE). The stamp can be constructed from any photo-resist epoxy that is stable at temperatures equal to the glass transition temperature (Tg) of the material to be stamped. The stamp can be used repeatedly without significant distortion of features. The stamp benefits from low relative cost, high fidelity of features in all three-dimensions and fast construction. The process for producing a stamp for hot embossing from a resist, comprising the steps of producing a seed layer L1 from a selected photoresist polymer material, soft baking the seed layer L1, exposing said seed layer L1 to initiate cross-linking and then post-exposure bake L1 to fully cross-link it, coating the cross-linked seed layer L1 with a second photoresist polymer layer L2; soft baking the second photoresist polymer layer L2; applying a mask to the top surface of the soft baked layer L2 and illuminating the unmasked portions of the soft baked layer L2 with UV radiation through the mask, wherein the exposed areas form the pattern of the embossing features, washing away un-exposed regions of the photoresist with a developer to leave behind a relief pattern formed in the second photoresist polymer layer L2, which relief pattern corresponds to a pattern in the mask.
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