发明名称 |
RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND PROCESS FOR MAKING RELIEF PRINTING PLATE |
摘要 |
A resin composition is provided that includes two or more types of compounds selected from the group consisting of (Component A) a compound comprising a silicon atom having a total of one or two alkoxy and hydroxy groups, (Component B) a compound comprising a silicon atom having a total of three alkoxy and hydroxy groups, and (Component C) a compound comprising a silicon atom having a total of four alkoxy and hydroxy groups. There are also provided a relief printing plate precursor that includes a relief-forming layer formed from the resin composition, a process for producing a relief printing plate precursor that includes a layer formation step of forming a relief-forming layer from the resin composition and a crosslinking step of thermally crosslinking the relief-forming layer so as to form a crosslinked relief-forming layer.
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申请公布号 |
US2011319563(A1) |
申请公布日期 |
2011.12.29 |
申请号 |
US201113169636 |
申请日期 |
2011.06.27 |
申请人 |
YAMASHITA KATSUHIRO;FUJIFILM CORPORATION |
发明人 |
YAMASHITA KATSUHIRO |
分类号 |
C08F116/06;B41C1/00;C08G77/04;C09K3/00 |
主分类号 |
C08F116/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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