发明名称 SUPPORT STRUCTURE AND PROCESSING APPARATUS
摘要 PURPOSE: A support structure and a processing device are provided to increase uniformity in a plane whose thickness is the same as the thickness of a film of a processed object placed on the top or the bottom of the support structure. CONSTITUTION: A wafer boat(46) is made of a top plate part(48), a bottom part(50), and a support pillar(60). An opening in the lower part of a processing container(44) is sealed by a cover part(62) made of quartz. A seal member(64) is placed between the lower part of the processing container and a part around the cover part. A table(68) is supported onto the top of a rotation axis(70) which penetrates the cover part. The rotation axis is attached to the leading end of an arm(74A) which is supported in an elevation machine(74).
申请公布号 KR20110138189(A) 申请公布日期 2011.12.26
申请号 KR20110058945 申请日期 2011.06.17
申请人 TOKYO ELECTRON LIMITED 发明人 ASARI SHINJI;OKADA MITSUHIRO
分类号 H01L21/205;H01L21/30;H01L21/683 主分类号 H01L21/205
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