| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing device and a method in which a substrate can be withdrawn (released) from a top ring of the substrate safely and efficiently by reducing deformation of the substrate such as a semiconductor wafer and a stress applied to the substrate, thereby preventing defect and damage of the substrate. <P>SOLUTION: The polishing device comprises a polishing table having a polishing surface, a substrate holding device having a substrate holding surface composed at least partially of an elastic membrane 4 and pressing a substrate W against the polishing surface while holding the substrate W on the substrate holding surface, a substrate transfer mechanism 150 which delivers the substrate W to/from the substrate holding device at a position where the substrate W is delivered to/from the substrate holding device, a substrate peeling promotion mechanism 153 provided integrally with or separately from the substrate transfer mechanism 150 in order to peel the substrate W from the substrate holding surface, a rotary drive mechanism which rotationally drives the substrate holding device, a detection mechanism which detects the rotation angle position of the substrate holding device, and a control unit 50 which controls the rotation angle position of the substrate holding device. <P>COPYRIGHT: (C)2012,JPO&INPIT |
