发明名称 |
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICES |
摘要 |
The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus includes a bonding module that has a vacuum chamber to provide bonding of wafers under pressure below atmospheric pressure; and a loadlock module connected to the bonding module and configured for wafer transfer to the bonding module. The loadlock module is also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure. |
申请公布号 |
US2011308721(A1) |
申请公布日期 |
2011.12.22 |
申请号 |
US20100888251 |
申请日期 |
2010.09.22 |
申请人 |
BROEKAART MARCEL;RADU IONUT |
发明人 |
BROEKAART MARCEL;RADU IONUT |
分类号 |
B29C65/00;B29C65/14;B32B37/00 |
主分类号 |
B29C65/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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