SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SUBSTRATE

摘要

Disclosed is a substrate for mounting a semiconductor element, which has a terminal section having excellent bonding performance with a sealing resin and excellent connecting characteristics with a bonding wire, and which can reduce manufacture cost and is sufficiently applicable to miniaturizing and thinning of a semiconductor device. Also disclosed is a method for manufacturing such substrate. The substrate at least has the terminal section (3), which has a layered section (12) configured of a plurality of layers wherein adjacent layers (10, 11) are respectively composed of a same kind of metal or alloy with different average crystal grain sizes, and which has a recessed section formed by etching on the side surface of the layered section (12), said recessed section having a step between the adjacent layers (10, 11).