发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADFRAME AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a paddle having an indented planar surface intersecting an outwardly extending planar surface at an angle of approximately 135 degrees plus 25 degrees or minus 5 degrees; mounting an integrated circuit over the paddle; and forming an encapsulation over the integrated circuit and under the extension void free. |
申请公布号 |
US2011309530(A1) |
申请公布日期 |
2011.12.22 |
申请号 |
US20100818750 |
申请日期 |
2010.06.18 |
申请人 |
SHEN GUO QIANG;YEE JAE HAK;YAO FENG |
发明人 |
SHEN GUO QIANG;YEE JAE HAK;YAO FENG |
分类号 |
H01L23/31;H01L21/56 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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