ALIGNER, CONTROL METHOD OF THE SAME, MANUFACTURING METHOD OF DEVICE, COMPUTER READABLE MEMORY, AND PROGRAM

摘要

PROBLEM TO BE SOLVED: To provide an aligner and a control method of the same capable of improving a throughput without deteriorating the positioning accuracy at the time of positioning of an original pattern with respect to each of a plurality of shot areas on a substrate.

SOLUTION: In the aligner and the control method, whether or not automatic measurement of a shot compensation parameter is performed is determined (S602), and processing is reduced by performing the automatic measurement of the shot compensation parameter only when the measurement is performed (S603). Then, the automatic measurement of a wafer compensation parameter is performed (S604). The positioning accuracy is maintained (S605) by determining whether a relative parameter δ between the shot compensation parameter and the wafer compensation parameter is calculated (S606) or the shot compensation parameter is calculated from the stored relative parameter δ and the wafer compensation parameter (S607) depending on whether or not the automatic measurement of the shot compensation parameter has been performed. According to the obtained shot compensation parameter and the wafer compensation parameter, the aligner is driven (S608) and light exposure is performed (S609).

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