发明名称 Method of manufacturing semiconductor thin film
摘要 On a translucent substrate, an insulating film having a refractive index n and an amorphous silicon film are deposited successively. By irradiating the amorphous silicon film with a laser beam having a beam shape of a band shape extending along a length direction with a wavelength λ, a plurality of times from a side of amorphous silicon film facing the insulating film, while an irradiation position of the laser beam is shifted each of the plurality of times in a width direction of the band shape by a distance smaller than a width dimension of the band shape, a polycrystalline silicon film is formed from the amorphous silicon film. Forming the polycrystalline silicon film forms crystal grain boundaries which extend in the width direction and are disposed at a mean spacing measured along the length direction and ranging from (λ/n)×0.95 to (λ/n)×1.05 inclusive, and crystal grain boundaries which, in a region between crystal grain boundaries adjacent to each other and extending in the width direction, extend in the length direction and are disposed at a mean spacing measured along the width direction and ranging from (λ/n)×0.95 to (λ/n)×1.05 inclusive.
申请公布号 US8080450(B2) 申请公布日期 2011.12.20
申请号 US20070596453 申请日期 2007.12.05
申请人 SUGAHARA KAZUYUKI;NAKAGAWA NAOKI;YURA SHINSUKE;TAKEGUCHI TORU;IRIZUMI TOMOYUKI;YAMAYOSHI KAZUSHI;SONO ATSUHIRO;MITSUBISHI ELECTRIC CORPORATION 发明人 SUGAHARA KAZUYUKI;NAKAGAWA NAOKI;YURA SHINSUKE;TAKEGUCHI TORU;IRIZUMI TOMOYUKI;YAMAYOSHI KAZUSHI;SONO ATSUHIRO
分类号 H01L21/84;H01L21/00;H01L21/205 主分类号 H01L21/84
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