发明名称 Thermoplastic resin composition with good heat stability, light stability, and impact strength
摘要 Disclosed herein is a thermoplastic resin composition with good heat stability, light stability and impact strength. In an exemplary embodiment, the thermoplastic resin composition comprises (A) about 10 to about 99 parts by weight of an epoxy group-containing styrenic resin; (B) about 1 to about 90 parts by weight of a polyester resin; (C) about 0.1 to about 10 parts by weight of a thermoplastic polyester resin comprising a cycloaliphatic diol such as cyclohexane dimethanol, per about 100 parts by weight of a base resin comprising (A)+(B); (D) about 0.05 to about 2 parts by weight of a hindered phenolic compound, per about 100 parts by weight of a base resin comprising (A)+(B); (E) about 0.05 to about 4 parts by weight of a phosphite compound, per about 100 parts by weight of a base resin comprising (A)+(B); and (F) about 0.2 to about 6 parts by weight of a compound comprising a HALS compound, benzotriazol based compound, or a combination thereof, per about 100 parts by weight of a base resin comprising (A)+(B).
申请公布号 US8080618(B2) 申请公布日期 2011.12.20
申请号 US20090477530 申请日期 2009.06.03
申请人 KIM JUN MYUNG;CHOI JIN HWAN;PARK JEE KWON;LEE JAE WON;CHEIL INDUSTRIES INC. 发明人 KIM JUN MYUNG;CHOI JIN HWAN;PARK JEE KWON;LEE JAE WON
分类号 C08L67/02;C08L25/08;C08L63/00;C08L63/10 主分类号 C08L67/02
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