发明名称 |
RESONATOR CHIP, RESONATOR, AND OSCILLATOR |
摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a decrease in Q value due to thermoelastic effect and decrease CI value at the same time. <P>SOLUTION: A resonator chip has: a base; and vibration arms that extend from the base and have bending vibration portions which bend and vibrate. The bending vibration portions have a pair of main surfaces approximately parallel to a vibration plane of the bending vibration of the vibration arms. The bending vibration portions have three or more grooves formed along a direction perpendicular to the vibration plane on both sides or either one side of the main surfaces. An outer planar surface perpendicular to the vibration plane of the vibration arms, a pair of outer walls formed by a nearest one of the grooves to the outer planar surface, and a plurality of inner walls formed by adjacent pairs of the grooves are formed, thereby electrically bending and vibrating part or all of the plurality of inner walls. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2011254352(A) |
申请公布日期 |
2011.12.15 |
申请号 |
JP20100127580 |
申请日期 |
2010.06.03 |
申请人 |
SEIKO EPSON CORP |
发明人 |
YAMADA AKINORI;FURUHATA MAKOTO |
分类号 |
H03H9/19;H01L41/09;H01L41/18;H01L41/187;H03B5/32;H03H9/215 |
主分类号 |
H03H9/19 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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