发明名称 |
FINGERPRINT SENSING CIRCUIT |
摘要 |
Fingerprint sensing circuit packages and methods of making such packages may comprise a first substrate having a top side and a bottom side; the top side comprising a fingerprint image sensing side over which a user's fingerprint is swiped; the bottom side comprising a metal layer forming a fingerprint sensing circuit image sensor structure; and a sensor control circuit housed in a sensor control circuit package mounted on the metal layer. The sensor control circuit may comprise an integrated circuit die contained within the sensor control circuit package. The fingerprint sensing circuit package may also have a second substrate attached to the bottom side of the first substrate having a second substrate bottom side on which is placed connector members connecting the fingerprint sensing circuit package to a device using a fingerprint image generated from the fingerprint sensing circuitry contained in the fingerprint sensing circuitry package.
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申请公布号 |
US2011304001(A1) |
申请公布日期 |
2011.12.15 |
申请号 |
US201113031557 |
申请日期 |
2011.02.21 |
申请人 |
ERHART RICHARD ALEX;NELSON RICHARD BRIAN;THOMPSON ERIK;PEREZSELSKY ARMANDO LEON;VALIDITY SENSORS, INC. |
发明人 |
ERHART RICHARD ALEX;NELSON RICHARD BRIAN;THOMPSON ERIK;PEREZSELSKY ARMANDO LEON |
分类号 |
H01L27/146 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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