| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a correction value acquisition method capable of acquiring a correction value for precise alignment when aligning a semiconductor wafer to a chuck table using image data. <P>SOLUTION: There are provided a step for positioning a sucking/holding part 64 of a wafer supply part 63 within an imaging range of an imaging part 36, a step in which the sucking/holding part 64 is linearly shifted within the imaging range and a linear shift locus of the sucking/holding part 64 in an orthogonal plane coordinates of a detection part 14 is acquired as linear motion imaging data, a step in which the sucking/holding part 64 is turned within the imaging range and a turn locus of the sucking/holding part 64 in the orthogonal plane coordinates of the detecting part 14 is acquired as a turn motion imaging data, and a step for calculating a correction value which corrects action deviation of the wafer supply part 63 in the orthogonal plane coordinates of the detection part 14 based on the linear motion imaging data and the turn motion imaging data. <P>COPYRIGHT: (C)2012,JPO&INPIT |
