| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing device and a dicing method, capable of preventing wiring pattern peeling, and chipping that occur on a work surface of such as a semiconductor wafer and a substrate. <P>SOLUTION: In the dicing device equipped with a blade having a tapered edge, for dicing on a work, the blade is so controlled as to gradually comes away from the work surface as advances from a dicing start point to a dicing end point. Otherwise, the work is arranged to be tilted so that, at the time of dicing, the blade rotates with no displacement, and the work surface is at such relative position as gradually comes away from the blade, as advances from the dicing start point to the dicing end point. Consequently wiring pattern peeling and chipping that occur on the work surface, on the rear side of the blade, are prevented. <P>COPYRIGHT: (C)2012,JPO&INPIT |
