发明名称
摘要 <p>A bond head assembly for use with a bonding machine includes a wire bonding tool and a link mechanism coupled between the wire bonding tool and the wire bonding machine. The link mechanism includes a frame, a plurality of arm links pivotably connected to the frame, and a tool support member supporting the wire bonding tool and pivotably connected to each of the arm links.</p>
申请公布号 JP4838918(B2) 申请公布日期 2011.12.14
申请号 JP20070525889 申请日期 2006.05.23
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
主权项
地址