发明名称 |
CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>Disclosed is a ceramic substrate having a ceramic substrate section, which is formed by firing a laminated body of a plurality of green sheets, and a chip-type electronic component, which is disposed inside of the ceramic substrate section. Furthermore, the ceramic substrate has a gap filling material, which is formed in a fillet shape in a peripheral region of an electrode section of the chip-type electronic component.</p> |
申请公布号 |
WO2011152544(A1) |
申请公布日期 |
2011.12.08 |
申请号 |
WO2011JP62861 |
申请日期 |
2011.05.30 |
申请人 |
PANASONIC CORPORATION;GOTOU, YUUJI;KUROIWA, TAIJI |
发明人 |
GOTOU, YUUJI;KUROIWA, TAIJI |
分类号 |
H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|