| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a piezoelectric device which can maintain bond strength between an element mounting member and a lid member and maintain productivity of a piezoelectric device. <P>SOLUTION: A manufacturing method for a piezoelectric device comprises: a resin layer formation process which provides a resin layer 112 on the outer peripheral part of one principal surface of an element mounting member 110; a resin layer hardening step which hardens the resin layer 112; a piezoelectric vibration element mounting process which mounts a piezoelectric vibration element 120 on the element mounting member 110 by conductive adhesive DS; a sealing resin formation process which provides sealing resin on the principal surface on the opening side of a wall part of a lid member configured by a lid main body and the wall part; a lid member bonding process which bonds the resin layer of the element mounting member and the sealing resin of the lid member. <P>COPYRIGHT: (C)2012,JPO&INPIT |
