| 摘要 |
In order to predict the lifetime of an electronic component mounted on a circuit board before the connecting section of the electronic component actually breaks, said lifetime being limited due to breakage of the connecting section of the electronic component, a method for predicting the lifetime of the semiconductor device which is mounted on the circuit board with a heat conducting member therebetween is provided, said circuit board having an electronic component mounted thereon. A current is synchronously carried to the semiconductor device, which is mounted on the circuit board with the first heat conducting member therebetween, and to a residual lifetime diagnosing section, which is mounted on the circuit board with a second heat conducting member therebetween, said second heat conducting member having a heat conductivity smaller than that of the first heat conducting member, a failure generated in the residual lifetime diagnosing section is detected by repeatedly and synchronously carrying currents, and the lifetime of the semiconductor device is predicted on the basis of the detected failure generated in the residual lifetime diagnosing section. |
