| 摘要 |
<P>PROBLEM TO BE SOLVED: To incorporate a heat sink easily in a simple structure, facilitate assembly and disassembly, and to easily remove restrictions on the increase of the size of the heat sink, relative decrease of cooling efficiency, and arrangement area for printing wires on a board. <P>SOLUTION: The board 41 on which heat generative electronic components 37 are mounted is accommodated in the base board case 27. A heat sink 39 that radiates the heat of the electronic components 37 is provided in the board case 27. A positioning holder 62 for positioning and holding the heat sink 39 on the internal face of the case body 33 of a board case 27 is provided opposite to the board 41. The heat sink 39 positioned and held by the position holder 62 is sandwiched between the case body 33 and board 41. <P>COPYRIGHT: (C)2012,JPO&INPIT |
