发明名称 STACKED SEMICONDUCTOR MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME, AND METHOD OF REPAIRING DEFECTS OF THROUGH SILICON VIAS
摘要 PURPOSE: A laminate semiconductor memory device, a memory system including the same, and a method for repairing a penetration electrode defect are provided to improve yield by repairing the penetration electrode defect. CONSTITUTION: A plurality of memory chips(120-150) are laminated on the upper side of a processor chip(110). A plurality of penetration electrodes(161) pass through the memory chips. Input and output buffers are combined between the memory chips and the penetration electrodes and selectively activated based on the defective status of the penetration electrodes. The input and output buffers are included in the memory chips.
申请公布号 KR20110131976(A) 申请公布日期 2011.12.07
申请号 KR20100051733 申请日期 2010.06.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 OH, TAE YOUNG;PARK, KWANG IL;YANG, YUN SEOK;SOHN, YOUNG SOO;KIM, SI HONG;BAE, SEUNG JUN
分类号 G11C5/06;G11C5/02;G11C7/10 主分类号 G11C5/06
代理机构 代理人
主权项
地址