| 摘要 |
PURPOSE: A semiconductor chip and a semiconductor package of a laminated chip structure including the same are provided to arrange an alignment pattern comprised of magnetic materials with opposite polarity in the upper and lower surface of the semiconductor chip, thereby accurately arranging the semiconductor chips by magnetic force between the alignment patterns. CONSTITUTION: A wiring pattern is arranged on a substrate(80). A plurality of semiconductor chips(101,102,103) is vertically laminated on the substrate. The semiconductor chip comprises alignment patterns(51a,51b,52a,52b,53a,53b) formed with magnetic materials. A filler(90) is filled in the space between the semiconductor chips. A molding material(95) seals a package by being filled in the space on the substrate. |
