发明名称 |
Method of fabricating microelectromechanical systems devices |
摘要 |
A method of fabricating microelectromechanical systems devices is disclosed. A silicon substrate having a plurality of microelectromechanical systems elements formed on a first surface thereof is provided. A guard layer defining a plurality of recesses is applied to the silicon substrate such that respective microelectromechanical systems elements are located within respective recesses. The silicon substrate is then segmented into discrete parts and an adhesive layer is bonded to a second surface of the silicon substrate. The guard layer is next segmented into discrete parts corresponding to the discrete parts of the silicon substrate, thereby forming individual microelectromechanical systems devices. Finally, the adhesive layer is selectively exposed to a light source allowing removal of individual microelectromechanical systems devices. |
申请公布号 |
US8070969(B2) |
申请公布日期 |
2011.12.06 |
申请号 |
US20080268966 |
申请日期 |
2008.11.11 |
申请人 |
SILVERBROOK KIA;SILVERBROOK RESEARCH PTY LTD |
发明人 |
SILVERBROOK KIA |
分类号 |
G01D15/00;B41J2/16;B81C;B81C1/00 |
主分类号 |
G01D15/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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