| 摘要 |
<p>Disclosed is a method for separating semiconductor wafers, wherein the wafers after being cut can be reliably separated one by one, and the wafers are not broken when the wafers are being separated. Since a separating liquid containing fine particles (P) is circulating in a separating bath (1), sludge of a cooling agent, cut dust and the like present between the cut wafers is removed from the spaces between the wafers, and the sludge is discharged as slurry from the bottom surface of the separating bath (1). Furthermore, while having the sludge removed from between the wafers, the fine particles (P) enter and stay between the wafers. Consequently, the wafers are prevented from sticking to each other, and the intervals are kept fixed.</p> |
