| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an encapsulated boron-based compound which has no hygroscopicity and, when kneaded with a resin or the like, is used as a flame retardant free from the possibility of the foaming and hydrolysis of the resin and easy to store. <P>SOLUTION: The encapsulated boron-based compound is prepared by adding a monomer to a boron-based compound dispersion liquid, adsorbing the monomer on a surface of the boron-based compound, hydrolyzing the monomer with water contained in the boron-based compound, subsequently carrying out dehydration condensation, and coating the boron-based compound with the resulting polymer, wherein a silicon alkoxide is preferable as the monomer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
