<p>PURPOSE: A wire bonding apparatus and a method thereof are provided to block heat supplied to a lead frame when a predetermined time is passed after the generation of a wire bonding error, thereby improving bonding properties of a wire bonding process by spraying a reduction gas. CONSTITUTION: A lead frame loading part(104) loads a lead frame with a mounted semiconductor chip to a transfer rail. A heater block heats the loaded lead frame. A wire bonding tool(108) performs a wire bonding process between the semiconductor chip and a lead of the lead frame. A lead frame unloading part(110) unloads the lead frame from the transfer rail in which the wire bonding process in the lead frame is completed. A control part senses malfunction of the wire bonding process generated in the lead frame. The control part separates the heater block from the lead frame when a predetermined time is passed after the generation of wire bonding malfunction.</p>
