| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which is highly sensitive with respect to light having wavelength of 350 nm to 410 nm and excellent in terms of resolution, adhesion and developing property after exposure and has a good solubility with respect to solution and with which a stable throughput can be obtained and deposit on resist hardly occurs. <P>SOLUTION: A photosensitive resin composition includes (A)a binder polymer, (B) a photopolymerization initiating compound, (C) a photopolymerization initiator and (D) N,N,N',N'-tetraaryl benzidine derivative expressed by the following formula (1) (in which R1 to R4 mean independently an alkyl group with 1 to 6 C-atoms, an alkoxy group with 1 to 6 C-atoms and a halogen atom or an amino group.) <P>COPYRIGHT: (C)2012,JPO&INPIT |
