| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus and a bonding method which permit visual alignment to be carried out with sufficient accuracy even when irregular pads of complex shapes are involved. <P>SOLUTION: When bonding a chip to a pad 10 formed on a substrate 5, if the pad 10 of concern is an irregular pad having a contour shape, not a rectangle, which makes visual alignment of positions difficult and an automatic recognition process in a recognition processing section does not work properly, a visual alignment process is carried out. In the visual alignment process, a reference pattern 5* is used which, when placed on top of a recognition image 5a, does not hinder visual confirmation of the recognition image 5a, and while manually moving the substrate 5 on a substrate holder 4, a pad image 10a and a pad pattern 10* are made to match on a display screen 25a by visual observation, whereby the reference position of the pad 10 is detected. <P>COPYRIGHT: (C)2012,JPO&INPIT |
