SEMICONDUCTOR CHIP WITH REINFORCEMENT LAYER

摘要

Various semiconductor chip reinforcement structures and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor chip that has a side and forming a polymer layer on the side. The polymer layer has a central portion and a first frame portion spatially separated from the central portion to define a first channel. An underfill material may be provided to invade the channel and establish a mechanical joint between the polymer layer and the underfill material.