发明名称 Plasma processing apparatus and method
摘要 A plasma processing apparatus includes in a processing chamber, a sample stage, a bell jar, a coil antenna, a Faraday shield, and a gas ring member located below a skirt portion of the bell jar and above the sample stage. The gas ring member supplies a process gas to a plasma generating space inside the bell jar from a gas port disposed on an inner surface of the gas ring member. A ring shaped plate is disposed near a periphery of the Faraday shield and having an inner surface facing and covering along the inner surface of the gas ring member and being spaced from the inner surface of the gas ring member so as to delimit a gap therebetween.
申请公布号 US8062473(B2) 申请公布日期 2011.11.22
申请号 US20080324125 申请日期 2008.11.26
申请人 NISHIO RYOJI;YOSHIOKA KEN;KANAI SABUROU;KANEKIYO TADAMITSU;KIHARA HIDEKI;OKUDA KOJI;HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 NISHIO RYOJI;YOSHIOKA KEN;KANAI SABUROU;KANEKIYO TADAMITSU;KIHARA HIDEKI;OKUDA KOJI
分类号 C23C16/00;C23C16/44;C23C16/455;C23C16/458;C23C16/507;H01J37/32;H01L21/00;H01L21/306 主分类号 C23C16/00
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