| 摘要 |
PURPOSE: A stacked package is provided to accomplish the slimming of the stacked package by attaching a passive device between semiconductor chips. CONSTITUTION: A first semiconductor chip(120) comprises a first semiconductor chip body(121), a first bonding pad(122), and a first grounding pad(124). A second semiconductor chip(140) comprises a second semiconductor chip body(141), a second bonding pad(142), and a second ground pad(144). A passive device(160) is attached between a first side(121a) of the first semiconductor chip body and a third side(141a) of the second semiconductor chip body. The passive device electrically interlinks the first and the second semiconductor chip. The passive device comprises a first capacitor electrode, a second capacitor electrode, and a dielectric layer. |
