发明名称 |
Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first internal integrated circuit structure and a second internal integrated circuit structure over the substrate; connecting the first internal integrated circuit structure and the second internal integrated circuit structure to the substrate with internal interconnects; forming asymmetric encapsulation structures above the first internal integrated circuit structure and the second internal integrated circuit structure; and encapsulating the first internal integrated circuit structure and the internal interconnects with an encapsulation.
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申请公布号 |
US8063477(B2) |
申请公布日期 |
2011.11.22 |
申请号 |
US20080328762 |
申请日期 |
2008.12.04 |
申请人 |
PAGAILA REZA ARGENTY;DO BYUNG TAI;CHUA LINDA PEI EE;STATS CHIPPAC LTD. |
发明人 |
PAGAILA REZA ARGENTY;DO BYUNG TAI;CHUA LINDA PEI EE |
分类号 |
H01L23/02;H01L21/44;H01L21/48;H01L21/50;H01L23/34 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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