发明名称 Heat dissipation device
摘要 A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting.
申请公布号 US8061411(B2) 申请公布日期 2011.11.22
申请号 US20090396484 申请日期 2009.03.03
申请人 XU SHOU-BIAO;ZHOU SHI-WEN;CHEN CHUN-CHI;FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.;FOXCONN TECHNOLOGY CO., LTD. 发明人 XU SHOU-BIAO;ZHOU SHI-WEN;CHEN CHUN-CHI
分类号 H05K7/20 主分类号 H05K7/20
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