| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pressure-contract type semiconductor device to prevent a coating body from being peeled off while preventing foreign matter from being mixed into a space formed between an external pressure-contact electrode body and a semiconductor substrate. <P>SOLUTION: The pressure-contract type semiconductor device comprises a sealing body 25 which is disposed over between the outer peripheral surface of the external pressure-contact electrode body and the coating body 5 so that one of the main surfaces of the semiconductor substrate 1 and mutually opposing surfaces of the external pressure-contact electrode bodies are surrounded from the outside of the semiconductor substrate 1, and in which, because of resulting deformation of the sealing body 25, the load on the coating body 5 remains equal to or less than the load required to peel off the coating body 5 from the semiconductor substrate 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
