| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor cooling device having a cooling pipe adjustable in its cooling performance. <P>SOLUTION: A semiconductor cooling device includes: first and second coolant spaces 26 and 27; inner fins disposed in the first and second coolant spaces 26 and 27, and forming a plurality of divided flow channels; and first and second circulation routes for letting a cooling medium circulate therein between a coolant inlet 21 and a coolant outlet 22. The first and second circulation routes include a plurality of divided flow channels different in cross sectional area. The first and second circulation routes are identical with each other in water conduction resistance. Since the first and second circulation routes have the same water conduction resistance, the quantities of flow of cooling medium running into the first and second circulation routes are identical with each other. In addition, as the first and second circulation routes include a plurality of divided flow channels having different cross sectional areas, the cooling medium is allowed to have different flow rates in the first and second circulation routes. Therefore the cooling performance of a cooling pipe 2 can be adjusted with no unnecessary increase in water conduction resistance. <P>COPYRIGHT: (C)2012,JPO&INPIT |
