| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring board in which a resistance change of a via hole conductor is small and dimensional accuracy is high in a reliability test, and to provide a method for manufacturing the multilayer wiring board. <P>SOLUTION: The method includes: a process for preparing first and second green sheets of which the burning shrinkage start temperatures are different from each other; a process for forming via holes in the first and second green sheets and applying conductor paste to the whole surfaces of inner walls of respective via holes to form tubular via hole conductor patterns; a process for filling the insides of the tubular via hole conductor patterns with glass ceramic paste to form cylindrical glass ceramic patterns; a process for forming surface wiring conductor patterns on the surfaces of the first and second green sheets so as to cover the tubular via hole conductor pattern and the cylindrical glass ceramic pattern; and a process for laminating and burning the first and second green sheets on which the surface wiring conductor patterns are formed. <P>COPYRIGHT: (C)2012,JPO&INPIT |
