| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of handling a semiconductor wafer that prevents the semiconductor wafer from cracking when a pressure-sensitive adhesive tape stuck on an adhesive layer is peeled. <P>SOLUTION: A method of handling a semiconductor wafer 1 comprises: a pressure-sensitive adhesive sheet 20 with fine adhesive strength; and the semiconductor wafer 1 bonded to a support plate 2 for semiconductor via the adhesive layer 3 and having a plurality of chips 5 arranged in a region other than a peripheral edge part 4, the method comprising: opposing and bonding the plurality of chips 5 of the semiconductor wafer 5 to the pressure-sensitive adhesive sheet 20, peeling the support plate 2 for semiconductor from the semiconductor wafer 1, and sticking a pressure-sensitive adhesive tape 12 on the remaining adhesive layer 3 of the semiconductor wafer 1 and peeling the pressure-sensitive adhesive tape 12 therefrom to remove the remaining adhesive layer 3. When a hollow opening 23 for storing the chips 5 of the semiconductor wafer 1 is defined and formed on the pressure-sensitive adhesive tape 20 and the pressure-sensitive adhesive tape 20 and chips are stuck together, the peripheral edge part 4 of the semiconductor wafer 1 at a peeling start place 13 of the pressure-sensitive adhesive tape 12 is stuck on a part 24 of a peripheral edge of the hollow opening 23. <P>COPYRIGHT: (C)2012,JPO&INPIT |
