VERTICAL PLATING EQUIPMENT AND PLATING METHOD THEREOF

摘要

PURPOSE: A vertical plating device and a plating method thereof are provided to prevent irregular ion distribution by rotating a wafer on a vertical plane in a plating process. CONSTITUTION: A vertical plating device comprises a plating sink(110), a carrier(120) and a magnetism actuating unit(130). The plating sink accepts electrolyte(101). The carrier supports a wafer(10). The carrier revolves on a support stand. The wafer is dipped in electrolyte. The wafer revolves in the electrolyte in order to be uniformly plated. The wafer revolves on the vertical plane. The magnetism actuating unit comprises a permanent magnetic element(131) and an electromagnetism element(132). The permanent magnetic element surrounds the carrier. The electromagnetism element is arranged within the carrier.