发明名称 ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME
摘要 To provide an electronic component mounting device having high productivity while enhancing the electromagnetic shielding effect, and a method for manufacturing the same. There is provided an electronic component mounting device 20 including a housing formed by a conductive metal material and electronic components 201, 202 to be mounted inside the housing, wherein the housing is configured by a first box body 200 and a second box body 203 fixed so that respective openings face each other and has a conductive layer 205 stacked through an insulating layer 208 arranged on an outer side of the first box body 200; and the first box body 200 includes a through-hole 204 for retrieving a conductive wire 206 connected to the electronic component 202 to the conductive layer 205, the through-hole 204 being arranged at a position covered by the conductive layer 205.
申请公布号 KR20110123256(A) 申请公布日期 2011.11.14
申请号 KR20117020647 申请日期 2010.04.15
申请人 OMRON CORPORATION 发明人 KAWAI WAKAHIRO
分类号 H05K9/00;H01L23/00 主分类号 H05K9/00
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