摘要 |
To provide an electronic component mounting device having high productivity while enhancing the electromagnetic shielding effect, and a method for manufacturing the same. There is provided an electronic component mounting device 20 including a housing formed by a conductive metal material and electronic components 201, 202 to be mounted inside the housing, wherein the housing is configured by a first box body 200 and a second box body 203 fixed so that respective openings face each other and has a conductive layer 205 stacked through an insulating layer 208 arranged on an outer side of the first box body 200; and the first box body 200 includes a through-hole 204 for retrieving a conductive wire 206 connected to the electronic component 202 to the conductive layer 205, the through-hole 204 being arranged at a position covered by the conductive layer 205. |