发明名称 FinFET structure with multiply stressed gate electrode
摘要 A semiconductor structure and its method of fabrication include a semiconductor fin located over a substrate. A gate electrode is located over the semiconductor fin. The gate electrode has a first stress in a first region located closer to the semiconductor fin and a second stress which is different than the first stress in a second region located further from the semiconductor fin. The semiconductor fin may also be aligned over a pedestal within the substrate. The semiconductor structure is annealed under desirable stress conditions to obtain an enhancement of semiconductor device performance.
申请公布号 US8058157(B2) 申请公布日期 2011.11.15
申请号 US20090505894 申请日期 2009.07.20
申请人 ZHU HUILONG;LUO ZHIJIONG;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 ZHU HUILONG;LUO ZHIJIONG
分类号 H01L29/72 主分类号 H01L29/72
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