| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inspection device of solid-state imaging element and an inspection method thereof capable of conducting an electric pixel defect inspection and a pixel defect inspection through image analysis, thereby improving yield. <P>SOLUTION: The inspection device of solid-state imaging element comprises; a tester 11 with a contact type probe 121b which conducts an electric defect inspection on a solid-state imaging element 2 composed of multiple pixels, an imaging section 123 which photographs a solid-state imaging element in which any defective pixel is found on the basis of the detection result of defective pixels by the tester 11, and a prober 12 with an image analyzing section (for example, an image analyzing section 112) which judges whether any foreign substance exists or not on the basis of an output image from the imaging section 123. <P>COPYRIGHT: (C)2012,JPO&INPIT |
